Atomic structures of a liquid-phase bonded metal/nitride heterointerface.

نویسندگان

  • Akihito Kumamoto
  • Naoya Shibata
  • Kei-Ichiro Nayuki
  • Tetsuya Tohei
  • Nobuyuki Terasaki
  • Yoshiyuki Nagatomo
  • Toshiyuki Nagase
  • Kazuhiro Akiyama
  • Yoshirou Kuromitsu
  • Yuichi Ikuhara
چکیده

Liquid-phase bonding is a technologically important method to fabricate high-performance metal/ceramic heterostructures used for power electronic devices. However, the atomic-scale mechanisms of how these two dissimilar crystals specifically bond at the interfaces are still not well understood. Here we analyse the atomically-resolved structure of a liquid-phase bonded heterointerface between Al alloy and AlN single crystal using aberration corrected scanning transmission electron microscopy (STEM). In addition, energy-dispersive X-ray microanalysis, using dual silicon drift X-ray detectors in STEM, was performed to analyze the local chemistry of the interface. We find that a monolayer of MgO is spontaneously formed on the AlN substrate surface and that a polarity-inverted monolayer of AlN is grown on top of it. Thus, the Al alloy is bonded with the polarity-inverted AlN monolayer, creating a complex atomic-scale layered structure, facilitating the bonding between the two dissimilar crystals during liquid-phase bonding processes. Density-functional-theory calculations confirm that the bonding stability is strongly dependent on the polarity and stacking of AlN and MgO monolayers. Understanding the spontaneous formation of layered transition structures at the heterointerface will be key in fabricating very stable Al alloy/AlN heterointerface required for high reliability power electronic devices.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

The effect of bonding temperature on the characteristics of TLP bonded joints in AISI 2205/BNi-3/AISI 2205 assembly

In the present study, the transient liquid phase bonding of AISI 2205 dual phase stainless steel with amorphous BNi-3 interlayer was carried out. Based on the initial experimental and analytical studies, the parameters of temperature and bonding time were determined. In order to investigate the effect of bonding temperature on the microstructural changes of the joint, bonding was performed in t...

متن کامل

The effect of bonding temperature on the characteristics of TLP bonded joints in AISI 2205/BNi-3/AISI 2205 assembly

In the present study, the transient liquid phase bonding of AISI 2205 dual phase stainless steel with amorphous BNi-3 interlayer was carried out. Based on the initial experimental and analytical studies, the parameters of temperature and bonding time were determined. In order to investigate the effect of bonding temperature on the microstructural changes of the joint, bonding was performed in t...

متن کامل

Analysis of defects on BN nano-structures using high-resolution electron microscopy and density-functional calculations.

Cubic boron nitride (c-BN) nucleation takes place on hexagonal boron nitride (h-BN) layers growing perpendicular to the substrate surface during thin film synthesis. Studies focused on the nucleation of the cubic phase suggest the possibility that transient phases and/or defects on these h-BN structures have a role in sp3-bonded cubic phase nucleation. In this study, we have investigated the na...

متن کامل

Infiltration of Reaction-Bonded Silicon Nitride with Equilibrium Y-Si-O-N Melt

An equilibrium Y-Si-0-N melt was infiltrated to eliminate the open porosity of reaction-bonded silicon nitride at 16001800°C. This oxynitride melt contained two equilibrium phases, a P-Si,N, solid phase and a liquid phase at high temperatures. Before infiltration, porous reaction-bonded silicon nitride compacts were heat-treated to completely transform to the P-Si3N, phase. After infiltration, ...

متن کامل

Transient liquid phase bonding of AISI 304L stainless steels with the austenitic and martensitic microstructures

In the present study, the effect of time and base metal microstructure on the Transient Liquid Phase (TLP) bonding of 304L stainless steel was studied. TLP was performed at 1050 0C for 5 and 60 minutes on the coarse grain austenitic and martensitic microstructure using BNi-2 interlayer. To prepare martensitic microstructure, as-received 304L was rolled at -15 0C up to 80% rolling reduction. TEM...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Scientific reports

دوره 6  شماره 

صفحات  -

تاریخ انتشار 2016